Method of making a circuit board

US 6,499,214 B2
Method of making a circuit board
Delin Li, San Jose, Calif. (US); Richard Keith McMillan, Dearborn, Mich. (US); and Zhong-You Shi, Ann Arbor, Mich. (US)
Assigned to Visteon Global Tech, Inc., Dearborn, Mich. (US)
Filed on 20-Mar-2001, as Appl. No. Visteon Global Tech, Inc., Dearborn, Mich. (US)
Int. Cl.7H05K 3/20

US 6,499,214 B2 Method of making a circuit board Delin Li, San Jose, Calif. (US); Richard Keith McMillan, Dearborn, Mich. (US); and Zhong-You Shi, Ann Arbor, Mich. (US) Assigned to Visteon Global Tech, Inc., Dearborn, Mich. (US) Filed on Mar. 20, 2001, as Appl. No. 9/812,449. Claims priority of provisional application 60/207647, filed on May 26, 2000. Prior Publication US 2002/0136873 A1, Sep. 26, 2002 Int. Cl.7H05K 3/20 U.S. Cl. 298212;831 13 Claims 1. A method for making a circuit board comprising the steps of: providing a first member having a first surface and a second surface; applying an etch resistant material to certain portions of said first and second surfaces, thereby exposing at least a first and a second portion of said first surface and at least a first and a second portion of said second surface, said first portion of said first surface being aligned with the first portion of said second surface and said second portion of said first surface being offset from said second portion of said second surface; creating a first aperture within said first member, said first aperture extending through said first portion of said first surface and said first portion of said second surface and having an interior surface which is substantially covered by said etch resistant material; selectively removing said second portion of said first surface and said second portion of said second surface, effective to create a second aperture within said first member and to cause said etch resistant material to flow within said second aperture; providing a first pre-circuit assembly; attaching said first pre-circuit assembly to a portion of said etch resistant material, effective to cause said first pre-circuit assembly to overlay said first and second apertures; selectively removing portions of said first pre-circuit assembly, thereby creating at least one air-bridge and lengthening said first and second apertures; and plating said first and second apertures, thereby creating a multi-layer circuit board.