US 6,499,213 B2
Assembling a stacked die package
Patrick W. Tandy,
Boise, Id. (US)
Assigned to Micron Technology, Inc.,
Boise, Id. (US)
Filed on 22-Jan-2001, as Appl. No. Micron Technology, Inc.,
Boise, Id. (US)
Int. Cl.7H05K 3/36
US 6,499,213 B2
Assembling a stacked die package
Patrick W. Tandy,
Boise, Id. (US)
Assigned to Micron Technology, Inc.,
Boise, Id. (US)
Filed on Jan. 22, 2001, as Appl. No. 9/766,743.
Application 09/766743 is a division of application No. 09/386623, filed on Aug. 31, 1999.
Prior Publication US 2001/0004802 A1, Jun. 28, 2001
Int. Cl.7H05K 3/36
U.S. Cl. 298212;830
3 Claims
1. A method of assembling multi-chip modules comprising:
singulating a first, relatively smaller die;
attaching the smaller die to a second, relatively larger die;
singulating the larger die; and
attaching the smaller and larger dice to a support structure.
